Job Description
Responsibilities
負責操作微型有源控制電路硬件模組與外購標準低功耗半導體晶片組件的算法寫入;執行柔性電路板 (FPC) 精密疊層調試、焊接與樣品組裝;對接大專院校先進實驗室並進行系統級光電路兼容性聯合壓測;對接大灣區合規製造鏈之精密代工工序,並負責倉庫物料、高純生化製劑與維修工具的日常防護管理
Requirements
Post-secondary (Bachelor Degree); 2 years of experience required; Fair Cantonese ; Fair Putonghua ; Fair English ; Able to read & write Chinese ; Able to read & write English ; 具2年或以上高精密微封裝、柔性電路板 (FPC) 調試與實驗室安全監督或小試產線管理操作經驗
Employment Terms
$30,000 - $33,000 per month, with Annual Leave 12 days, Mon to Fri: 9:00AM-6:00PM, 5 working days per week, 8 working hours per day
How to Apply
Job seekers may e-mail(haolingke@gmail.com) resume to GLOBAL SPATIAL INFRASTRUCTURE LAB (GSIL) LIMITED. To obtain a copy of Personal Information Collection Statement, please contact MS. HAO by Email.
Remarks
** For this job vacancy, the employer may enroll for joining the Employment Programme for the Elderly and Middle-aged and hence elderly and middle-aged job seekers are welcome to apply.
Source: Labour Department Interactive Employment Service
資料來源:香港特別行政區政府勞工處互動就業服務。此職位由系統自動同步,詳情請參閱勞工處官方網站。